IEC 60068-2-14: Environmental Testing – Part 2-14: Tests – Test N: Change of Temperature

Overview and Purpose

IEC 60068-2-14 is an integral part of the IEC 60068 environmental testing series, focusing on the change of temperature testing for electronic equipment. This standard specifies the procedure for exposing specimens to rapid changes in temperature, simulating conditions that might be encountered during transportation, storage, or operational use. The purpose of Test N: Change of Temperature is to determine the ability of components and equipment to withstand thermal shock and thermal stress, assessing their reliability and structural integrity under such conditions.

How the Test is Conducted

  1. Preparation: Specimens are prepared according to their operational instructions, ensuring they are in the appropriate state for testing. This might involve setting them to a specific operational mode or condition.
  2. Temperature Cycling: The specimen is subjected to rapid and sequential changes in temperature between two extremes, typically from a low-temperature environment to a high-temperature environment and back. The rate of temperature change, the duration at each extreme, and the number of cycles are defined based on the product’s intended use and environmental exposure.
  3. Stabilization Periods: At each temperature extreme, the specimen is held for a specified period to allow the entire specimen to stabilize at the target temperature, ensuring uniform exposure.
  4. Monitoring and Evaluation: Throughout the test, the specimen’s response to the temperature changes is monitored. After completing the cycles, the specimen is evaluated for any signs of damage, malfunction, or degradation in performance. This evaluation includes visual inspections, functional tests, and measurements of electrical and mechanical properties.

Purpose of the Standard

  • Thermal Shock Resistance: Assesses the specimen’s resistance to thermal shock, ensuring that electronic components and equipment can withstand rapid changes in temperature without failure.
  • Structural Integrity: Evaluates the impact of thermal stress on the specimen’s structural integrity, identifying potential weaknesses in materials or assembly.
  • Design Validation: Provides critical data for validating the thermal design of products, allowing manufacturers to make necessary adjustments to improve thermal resilience.
  • Quality Assurance: Serves as a key component of quality assurance processes, confirming that products meet international standards for resistance to temperature changes.

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